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Sun Chemical's Jim Felsberg to speak at Harper Roadshow

October 21, 2013

The SMART Roadshow is scheduled for November 5 at Uteco’s facility in Kennesaw, GA, USA.

Sun Chemical’s Jim Felsberg will speak about a variety of packaging options for flexible packaging printers at the Harper Anilox SMART Roadshow, scheduled for November 5 at Uteco’s facility in Kennesaw, GA, USA.

Coordinating with the tour’s “Showcasing Modern Anilox Roll Technology” (SMART) theme, Felsberg, a field marketing manager for Sun Chemical, will talk about low migration products, high speed inks, and specialty inks and coatings.

“The needs and requirements of flexible packaging continues to evolve,” Felsberg says. “From high speed/high quality printing demands to the growing trend toward tighter regulations on food contact packaging, to brand owner requirements for packaging that is unique and pops off the shelf, converters need solutions to meet the changing demands in the industry. We look forward to using the Harper Roadshow as a venue where we can help converters understand how Sun Chemical can help with their packaging needs.”

Felsberg will discuss how low migration packaging products for flexo printers are being defined in terms of solvent-based inks in the marketplace and will explain how low migration inks are just one part of a low migration packaging products.

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