Global anilox roll supplier Harper Corporation of America says it was proud to participate in the tenth annual Printed Electronics USA 2013 conference and trade show, sponsored by IDTechEx. The three-day event featured 150 exhibiting companies and more than 180 presentations. Attendees were able to learn more about the latest technology available and how it impacts end-user requirements.
During this event, Harper joined with three universities to provide live demonstrations of the flexographic and gravure printing processes used in the package printing industry. “Teaming up with Cal-Poly, Clemson, and Western Michigan University was a great combination for the event,” says Alex James, director of graphic solutions for Harper Corporation. "Their students demonstrated the Harper supplied QD Printing systems by printing the actual inserts of the handouts that were provided to the attendees.”
While Harper supplied four HarperScientific QD Printing systems, Cal-Poly provided a screen printer. This allowed attendees to see the full scope of the processes and get a better feel for what these technologies offer. They could ask questions and explore the capabilities of each process system.
Not only did attendees benefit, organizers say, but the students did as well. “This is the best case scenario,” says Chip Tonkin, director of the Sonoco Institute at Clemson. “Being able to show the PE industry the capabilities of package printing processes and exposing our students to industry attendees – having them interact with them – was better than any classroom could create.”
Harper Corporation of America says it was proud to play such an integral role in this successful venture and share its expertise with professionals and students alike. “The combined booth brought together Harper professionals with undergraduates from Cal-Poly, Master’s students from Clemson, and PhD students from Western Michigan, producing very informed discussions with the many conference attendees who stopped by,” states Harper’s VP of Sales Alan Rogers. The conference was held in Santa Clara, CA, USA, from November 19-21, 2013.