TLMI’s Young Leaders Development Organization will host the 2nd Global Congress for industry management professionals September 11-12, 2014 at Michigan State University immediately following Labelexpo Americas 2014.
The congress program includes networking opportunitie, a skills development workshop and presentations on packaging innovation and sustainability.
The 1st Congress was hosted by European sister association FINAT in 2012 in Germany. This time, TLMI is extending the invitation to its members and colleagues abroad.
The School of Packaging at Michigan State University, the event's location, has built significant research expertise and earned national and international recognition for over five decades of work. MSU has conferred more than 7,000 academic degrees – and is known worldwide as the leading resource for developing package professionals.