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Bemis receives FPA's Achievement Award



Published April 15, 2014
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Bemis Company, Inc. received Flexible Packaging Achievement Awards for two packaging products at the Flexible Packaging Association's 58th annual Achievement Awards and Innovation Showcase, held recently in Scottsdale, AZ, USA. In the Technical Innovation category, the Hillshire Brands Heat FreshT package won a gold award. In the Packaging Excellence category and also in the Sustainability and Environmental Achievement category, the Bonfire Standup Pouch won a gold award and a silver award, respectively.

"Using innovation and expertise in polymer science, we transform our customers' ideas and needs into packaging solutions for their brands while meeting consumer demand for freshness, appeal, and convenience. We are honored to receive these Packaging Achievement Awards, a testament to our investment in innovation over the years," says William Jackson, vice president and chief technology officer of Bemis Company. "We are pleased to collaborate with innovative customers like Hillshire and Bonfire to provide unique solutions."

The Hillshire Brands Heat FreshT package combines proprietary films and innovative features to control moisture, heat, and pressure during microwaving. This package was designed to solve the perpetual need in microwavable sandwich kits to keep the bread soft while heating the rest of the product. These innovations can be integrated into a wide range of heat-and-eat solutions.

The Bonfire Standup Pouch features Bemis' Liquiflex AdvanceT inner layer for maximum barrier, strength, stiffness, and freshness. Using Bemis' film technology for a first-in-kind shaped barrel pouch, this package solved the "sagging" challenge common to liquid packaging. While the pouch's portability and one-touch dispensing feature address consumer convenience needs, Bemis film technology ensures consistent quality during the distribution process. As compared to the alternative glass bottle packaging format, the Bonfire Standup Pouch offers a significantly smaller carbon footprint over the package life cycle.


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