Dow Corning has introduced two new thermally conductive adhesives developed to enable design of more compact, reliable and higher performing automotive electronics assemblies. The new silicone technologies include Dow Corning TC-2030 Thermally Conductive Adhesive, the company’s “most advanced solution” for traditional automotive electronics applications, and Dow Corning TC-2035 Thermally Conductive Adhesive, a high-performance thermal interface material for high-heat automotive applications, such as next-generation power electronic modules. Formulated with field-proven thermally conductive fillers, TC-2030 reduces thermal resistivity with a high thermal conductivity of 2.7 W/mK. A two-part, heat-cured silicone technology, TC-2030 Thermally Conductive Adhesive delivers a significant improvement in elongation performance for a material of such high thermal conductivity. TC-2035 Thermally Conductive Adhesive is designed to manage heat in next-generation automotive applications, including power electronics for electric and hybrid electric vehicles.
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