07.19.05
RFID circuit
Matrics
Columbia MD USA
The UHF RFID Integrated Circuit will be embedded in the next generation of smart inlays and labels. The smaller chips will be less expensive to manufacture for two reasons: more chips can be produced from each silicon wafer and the chips are produced using a standard Complementary Metal Oxide Semiconductor process, the lowest cost silicon fabrication process.
410-872-0030
fax 410-872-0070
www.matrics.com
Circle No. 109
Matrics
Columbia MD USA
The UHF RFID Integrated Circuit will be embedded in the next generation of smart inlays and labels. The smaller chips will be less expensive to manufacture for two reasons: more chips can be produced from each silicon wafer and the chips are produced using a standard Complementary Metal Oxide Semiconductor process, the lowest cost silicon fabrication process.
410-872-0030
fax 410-872-0070
www.matrics.com
Circle No. 109
