Smart Packaging expo
joins Labelexpo 2004
Smart Packaging 2004 is being launched alongside Labelexpo Americas 2004, and will take place September 14-15 at the Donald E. Stephens Convention Center in Chicago, IL.
Developed in co-operation with the Institute of Packaging Professionals (IOPP), the two-day conference will cover all aspects of smart packaging and is expected to attract in excess of 200 delegates from the label, packaging and end user sectors. Delegates will also be able to visit Labelexpo Americas 2004. In addition, the event will be supported by the Tag & Label Manufacturers Institute (TLMI).
Four conference sessions are planned for the two days of Smart Packaging 2004. These will include papers presented by leading brand owners/end users in the food/supermarket, drugs, drinks, cosmetics/toiletries and household/consumer products sectors; package protection requirements and solutions ranging from counterfeit deterrence, retail theft and tamper resistance; package authentication and verification requirements; and logistics, handling and storage, and supply chain management — including RFID, smart labels, and chipless labels.