A successor to the TAL 10000, the 20000 “provides a quantum jump” in flip chip assembly technology for RFID inlays. The company says that assembly and test speeds have doubled to 20,000 inlays per hour.
The TAL 20000 can work with chips ranging from 0.3 x 0.3mm to 3.0 x 3.0mm, and all types of available antenna technologies – for labels, tickets, baggage tags, contactless cards, and so forth. “Furthermore,” the company announced, “the TAL 20000 platform is ready to cover future applications for multi-component labels, e.g., battery assisted tags, just by adding an additional component feeder. With a web width of up to 610mm the TAL 20000 fits to the standard formats of the card industry to introduce flip chip inlays into the contactless card market.”