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New shrink material introduced by Avery Dennison

May 23, 2011

The PS shrink substrate, introduced at Interpack, is aimed at the meat and dairy packaging market.

A new pressure sensitive substrate for meat and dairy packaging applications was introduced by Avery Dennison at Interpack in Germany this month. The patent-pending product, called Avery Dennison Shrink PS, is engineered to survive the vacuum-shrink process without wrinkling.

Potential applications include the labeling of processed meats, fresh red meats, poultry and cheese products.

“Avery Dennison Shrink PS is an exciting innovation that has both brand-enhancing and production-related benefits,” says Bassam Hallak, global segment director - food. “This is an example of how Avery Dennison can help customers overcome difficult technical challenges and achieve packaging solutions with high visual impact.”

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