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Dscoop9 to 'Break the Mold' in Orlando

January 16, 2014

This year's conference will feature nearly 100 education sessions that cover the most pressing business challenges taking place in the digital print industry.

Taking place March 6-8 in Orlando, FL, USA, the Dscoop9 conference, “Break the Mold,” will feature nearly 100 education sessions that cover "the most pressing business challenges taking place in the digital print industry."

"In the true essence of the Break the Mold theme, Dscoop9 will be different from previous years," organizers say. New features of the conference will include interactive sessions - as opposed to presentations - to facilitate conversation and idea-sharing; a new variety of session formats including roundtable discussions, workshops, and live panels; dedicated and scheduled time for networking activities; and the new Dscoop mobile app. 

Sessions are open to all Dscoop members, and attendees can participate in one track or mix and match sessions based on needs or interests. To complement the three days of conference education and networking, Dscoop University will makes its debut at Dscoop9, offering eight Dscoop University courses on Thursday, March 6 from 8 a.m. – 11 a.m. These courses are interactive, small group, three-hour workshops that focus on a specific topic and will allow Dscoop members to roll up their sleeves. 

For a detailed descriptions of each interactive session and Dscoop University course, visit www.dscoop9.org.

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