07.19.05
Comco launches new series of flexo seminars
Comco’s popular education programs for flexographers continues in 2003 with five in a series of “Flexo Focus Educator Seminars.” The free seminars have been developed for converters and consumer packaging professionals seeking market and technical information about growing niche applications.
The programs, which feature live demonstrations on press, are held in the Comco Advanced Training and Technology Center in Cincinnati. The 2003 schedule for the one-day events is as follows:
• March: Cut-n-Stack Markets and Applications
• May: Pre-made Pouch Structures
• June: Folding Carton, Featuring Heavy Duty, High Speed Diecutting
• September: Flexible Roll Fed Labels
• November: Flexible Packaging and Solvent Printing
The first is scheduled for March 12, 2003 at the Comco Advanced Training and Technology Center in Cincinnati. The Cut-n-Stack seminar will examine traditional wrap-around cut-n-stack labels as well as both cut-n-stack shrink and new developments in wrap-around roll fed labeling markets and technology. The day’s event will take converters and end users through existing and potential cut-n-stack markets, the film materials for these markets, printing and converting of cut-n-stack applications and the final application of labels to a finished package.
For more information, or to register, visit www.comcointl.com or contact Julie Martin at 800-UVFLEXO.
Comco’s popular education programs for flexographers continues in 2003 with five in a series of “Flexo Focus Educator Seminars.” The free seminars have been developed for converters and consumer packaging professionals seeking market and technical information about growing niche applications.
The programs, which feature live demonstrations on press, are held in the Comco Advanced Training and Technology Center in Cincinnati. The 2003 schedule for the one-day events is as follows:
• March: Cut-n-Stack Markets and Applications
• May: Pre-made Pouch Structures
• June: Folding Carton, Featuring Heavy Duty, High Speed Diecutting
• September: Flexible Roll Fed Labels
• November: Flexible Packaging and Solvent Printing
The first is scheduled for March 12, 2003 at the Comco Advanced Training and Technology Center in Cincinnati. The Cut-n-Stack seminar will examine traditional wrap-around cut-n-stack labels as well as both cut-n-stack shrink and new developments in wrap-around roll fed labeling markets and technology. The day’s event will take converters and end users through existing and potential cut-n-stack markets, the film materials for these markets, printing and converting of cut-n-stack applications and the final application of labels to a finished package.
For more information, or to register, visit www.comcointl.com or contact Julie Martin at 800-UVFLEXO.