Print

Diecutting symposium planned for 2004



Published July 20, 2005
Related Searches: Embossing
Post a comment
Diecutting symposium planned for 2004
June 24 and 25 are the dates of a 2004 event titled “Diecutting Symposium Educational Conference & Exhibition,” to be held in the Nashville Convention Center and sponsored by Larson WorldWide Inc. The theme of the program is “Keeping One or Two Steps Ahead of the Competition.”
The event is produced for converting companies that utilize diecutting, embossing and foil stamping in their converting processes, and tooling providers that provide diecutting tooling plus embossing and foil stamping dies to converting companies.
For more information, contact Larson at 800-229-3346. The e-mail address is larson@dieco.com, and the Internet address is www.dieco.com.


blog comments powered by Disqus

Top Searches
L&NW ENewsletter
Sign up now to receive the free weekly newsletter

Enter your email address:
Top Articles
Follow L&NW On