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Diecutting symposium planned for 2004

July 20, 2005

Diecutting symposium planned for 2004
June 24 and 25 are the dates of a 2004 event titled “Diecutting Symposium Educational Conference & Exhibition,” to be held in the Nashville Convention Center and sponsored by Larson WorldWide Inc. The theme of the program is “Keeping One or Two Steps Ahead of the Competition.”
The event is produced for converting companies that utilize diecutting, embossing and foil stamping in their converting processes, and tooling providers that provide diecutting tooling plus embossing and foil stamping dies to converting companies.
For more information, contact Larson at 800-229-3346. The e-mail address is larson@dieco.com, and the Internet address is www.dieco.com.
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