05.25.18
The manufacturing efficiency of in-mold labeling, decoration, and production has in recent years expanded the technology’s adoption into major current manufacturing arenas. In parallel with these new industry developments, AWA Alexander Watson Associates has extended the brief for its annual conference on in-mold labeling to embrace two lively additional in-mold markets: in-mold decoration, and electronics applications.
This new event, AWA IMLCON, IMDCON, and IMECON, will be held in Amsterdam, the Netherlands, from September 10-11, and will enable industry participants at all levels and others interested in exploring the possibilities to gain an expert update on three major pathways in in-mold manufacturing today.
AWA IMLCON, IMDCON, and IMECON will combine plenary sessions with concurrent application-specific sessions and a tabletop exhibition to make it easy for delegates to gain in-depth insights on the topics that interest them.
With the addition of in-mold electronics to the program, participants can explore this leading-edge technology, which enables the installation of electronic circuitry into injection-molded plastic components during mainstream production and with a much-reduced need for costly and time-consuming secondary operations. AWA is looking to establish a networking and learning interface for this emerging market, and it has strategically organized the conference in Amsterdam in response to the strength of the European market.
AWA has been following in-mold technology developments through in-depth market studies and in an annual event for over 20 years. As well as gaining the latest market data from AWA consultants, this year’s conference delegates will hear from expert speakers from the different technology streams, including Advanced Decorative Systems, Tactotek, Berhalter, Brigl & Bergmeister, DuPont, Elantas Europe, Niebling GmbH, Serigraph, the Holst Centre (TNO), and Yupo.
The event is supported by platinum sponsors Holst Centre, Taghleef Industries, and Yupo Corporation; and gold sponsors Advanced Decorative Systems, Berhalter, Brigl & Bergmeister and Elantas Europe.
This new event, AWA IMLCON, IMDCON, and IMECON, will be held in Amsterdam, the Netherlands, from September 10-11, and will enable industry participants at all levels and others interested in exploring the possibilities to gain an expert update on three major pathways in in-mold manufacturing today.
AWA IMLCON, IMDCON, and IMECON will combine plenary sessions with concurrent application-specific sessions and a tabletop exhibition to make it easy for delegates to gain in-depth insights on the topics that interest them.
With the addition of in-mold electronics to the program, participants can explore this leading-edge technology, which enables the installation of electronic circuitry into injection-molded plastic components during mainstream production and with a much-reduced need for costly and time-consuming secondary operations. AWA is looking to establish a networking and learning interface for this emerging market, and it has strategically organized the conference in Amsterdam in response to the strength of the European market.
AWA has been following in-mold technology developments through in-depth market studies and in an annual event for over 20 years. As well as gaining the latest market data from AWA consultants, this year’s conference delegates will hear from expert speakers from the different technology streams, including Advanced Decorative Systems, Tactotek, Berhalter, Brigl & Bergmeister, DuPont, Elantas Europe, Niebling GmbH, Serigraph, the Holst Centre (TNO), and Yupo.
The event is supported by platinum sponsors Holst Centre, Taghleef Industries, and Yupo Corporation; and gold sponsors Advanced Decorative Systems, Berhalter, Brigl & Bergmeister and Elantas Europe.
